Element Solutions Inc has completed the acquisition of the Micromax conductive pastes and inks business, consolidating its role as a key materials supplier to advanced power electronics and electric drive systems. Effective 2 February 2026, Micromax now operates within MacDermid Alpha Electronics Solutions, the electronics arm of Element Solutions, bringing a portfolio that is already widely used in automotive, e-mobility and high‑reliability applications.
For OEMs and Tier‑1s developing next‑generation inverters, onboard chargers and control electronics, the move creates a single source for thick‑film conductive inks, pastes and ceramic materials engineered for harsh environments. The Micromax range includes thick‑film inks compatible with polymer films, glass tapes, metals and ceramics, as well as Low Temperature Co‑Fired Ceramic (LTCC) systems designed for high multilayer circuit density and operation under extreme thermal and mechanical stress. These technologies are already established in critical functions such as circuitry, interconnection and packaging in automotive and advanced mobility electronics, where long‑term reliability under vibration, temperature cycling and high power densities is essential.
Richard Fricke, President, Electronics at Element Solutions, describes the acquisition as a strategic fit that reinforces the group’s focus on high‑value, technology‑driven businesses. He points to Micromax’s differentiated materials and long‑standing customer relationships as key assets that will strengthen the Electronics segment and broaden its support for innovation across the electronics manufacturing ecosystem.
Integrated materials platform
By combining Micromax’s specialty materials with MacDermid Alpha’s existing electronics portfolio, Element Solutions is positioning itself as a partner for system designers working across vehicle electrification, 5G and high‑density electronics. MacDermid Alpha already supplies high‑performance specialty chemicals, materials and process technologies covering circuitry formation, wafer‑level and semiconductor assembly, PCB assembly and film and smart surface solutions. The enlarged portfolio targets a broad set of end markets including automotive and advanced mobility, telecommunications and 5G infrastructure, consumer electronics, aerospace and defence, medical devices, data infrastructure and high‑performance computing.
For design engineers, the combined offering promises greater flexibility in tailoring interconnect, substrate and packaging solutions to specific mission profiles, from compact power modules to high‑frequency communication hardware. In practice, that could mean tighter integration between conductive pastes, LTCC substrates and surface‑finish chemistries, with the aim of optimising thermal management, form factor and reliability at system level.
“Building breakthroughs” with materials co-development
Bruce Moloznik, Senior Vice President Business Integration at MacDermid Alpha Electronics Solutions, underlines the complementarity between the two organisations’ technology roadmaps. He notes that Micromax brings deep materials expertise that aligns with MacDermid Alpha’s mission, enabling closer collaboration with customers to accelerate innovation and deliver high reliability in demanding electronics markets. The company frames the deal as an opportunity to “build breakthroughs” by co‑developing materials stacks that respond to emerging requirements in areas such as wide‑bandgap power electronics, compact high‑temperature modules and rugged sensing.
Operating under the Element Solutions umbrella, MacDermid Alpha benefits from the parent company’s global footprint and investment capacity. Element Solutions is a global specialty chemicals group supplying technologies that enhance manufacturing processes in consumer and power electronics, semiconductor fabrication, communications and data storage, automotive systems, industrial surface finishing and offshore energy.
