Texas Instruments (TI) has introduced a series of power management innovations aimed at enhancing the performance, efficiency, and reliability of electric mobility and fast-charging systems. These new semiconductor-based solutions span key applications including automotive charging, USB Power Delivery (PD), and robust short-circuit detection for onboard power electronics.
Among the most notable advancements is the UCC25661-Q1, automotive-qualified LLC controller specifically designed for light electric vehicle (LEV) charging. Featured in a three-stage AC/DC charger for two-wheeled EVs, this primary-side controller integrates TI’s patented Input Power Proportional Control (IPPC) technology, enabling engineers to achieve double the power density compared to conventional designs. This advancement supports the development of compact, high-efficiency, and highly reliable power supplies for next-generation LEVs.
TI also launched the UCG28826, the industry’s first self-biased GaN flyback converter. Optimized for next-gen fast-charging applications, this device importante for power management is at the heart of TI’s new 65-W dual-port USB PD charger reference design. Capable of operating from 90 VAC to 264 VAC, the UCG28826 meets stringent efficiency and standby power requirements, all while delivering high power density in a compact form factor.
Additionally, TI has partnered with Flex to present a new short-circuit detection reference design for automotive onboard chargers and DC/DC converters. This design evaluates various sensing methodologies—shunt-based, desaturation, and Hall-effect sensors—to optimize short-circuit detection in SiC-based MOSFET applications. The collaborative solution highlights best practices in current sensing location, component selection, and PCB layout to meet demanding safety and reliability standards in high-voltage automotive environments.
The breadth of TI’s portfolio and its deep system design expertise, showcased at PCIM, enable power engineers to achieve high performance, reliability, and scalability in their next-generation applications,” said Mark Ng, Automotive Systems Director. “In the automotive sector, for example, our efficient, high power-density semiconductors make it possible to design virtually every aspect of the system—from extending driving range and optimizing charging to enabling new architectures for a feature-rich user experience.”